Product
Processing of Semiconductors
Polyimide Tape
For the process of printing circuit boards and the process of semiconductor parts
| Grade No. | Structure | Materials | Adhesive | Heat Resistance | Thickness | |
|---|---|---|---|---|---|---|
| Base Film | Total | |||||
| HKSI-2525 |
|
Polyimide | Silicone | 250℃ | 25㎛ | 50㎛ |
| HKSI-2530 |
|
Polyimide | Silicone | 250℃ | 25㎛ | 55㎛ |
| HKSI-5030 |
|
Polyimide | Silicone | 250℃ | 50㎛ | 80㎛ |
Drag it to the right to see it.
* Internal specification can be changed when required by the user
EMI Shielding Tape
For shielding of electromagnetic interference, such as IT, electronic devices, etc
| Grade No. | Structure | Materials | Adhesive | Maximum Resistance | Thickness | |
|---|---|---|---|---|---|---|
| Base Film | Total | |||||
| HKC-4030 |
|
Copper | Conductive Acrylic |
0.3Ω | 40㎛ | 45㎛ |
| HKA-5030 |
|
Aluminium | Conductive Acrylic |
0.4Ω | 50㎛ | 55㎛ |
| HKA-3830 |
|
PET+Aluminium | Conductive Acrylic |
0.3Ω | 38㎛ | 43㎛ |
Drag it to the right to see it.
* Internal specification can be changed when required by the user